Gold wire from IC integrated circuit chips

Gold wire from IC (integrated circuit) chips is an ultra-thin, high-purity gold wire used for bonding semiconductor components. It connects the silicon chip to the lead frame, allowing electrical signals to pass between the chip and the circuit board. This process, called wire bonding, is crucial in microelectronics due to gold's excellent conductivity, corrosion resistance, and reliability. However, due to high costs, manufacturers sometimes replace gold with copper or silver. Recovering gold from IC chips is a common practice in e-waste recycling, where the chips are processed to extract and refine the gold.

**Gold wire from IC (integrated circuit) chips** is a fine, high-purity gold wire used in **wire bonding** to connect semiconductor chips to their packaging. Gold is chosen for its excellent **electrical conductivity**, **corrosion resistance**, and **reliability** in microelectronics. However, due to cost concerns, some manufacturers replace it with **copper or silver wire**. In **e-waste recycling**, IC chips are processed to extract **gold wire**, which is refined and reused in various industries.